Only Top Quality Products
Only products from trusted brands
We respond within 24 hours
100% SSL Secure Payments
Free shipping on orders $99.99+
Copper3D PLACTIVE AN1™ - Antimocrobial PLA Filament (750g)
Copper3D PLACTIVE AN1™ Antimicrobial PLA Filament
FDA Registered and ISO Compliant
We are excited to offer Copper3D PLACTIVE antimicrobial filaments in Canada. Copper3D is an industry leader when it comes to antimicrobial filaments and they have the science to back it up. The antimicrobial properties have been confirmed by two microbiology laboratories in both Chile and the USA. Not only that, PLACTIVE™ is a FDA registered material and EU compliant (No. 10/2011, No. 1935/2004 and No. 2023/2006). The manufacturer also has certification ISO 9001/2015 and is REACH compliant.
Copper3D PLACTIVE AN1™ offers a scientifically validated and innovative premium quality PLA which has a patented Nano-Copper additive. Thanks to this specialized combination, the material has proven to eliminate more than 99.99% of fungi, viruses, bacteria and a wide range of microorganisms. This was verified by the results of two studies conducted by microbiology laboratories in USA and Chile1,2. Both studies confirm that the Colony Forming Units (CFU) of Staphylococcus aureus MRSA and Escherichia coli DH5α, falls abruptly during the first 6 hours of exposure to PLACTIVE (>95%), continuing the elimination of bacterial strains until reaching >98% elimination at 8 hours and >99.99% elimination at 24 hours.
1. SITU Biosciences Microbiology Laboratory, USA.
2. Microbiology Laboratory of Universidad Católica de Valparaíso, Chile.
This material has been clinically tested in prosthesis for amputees with excellent results. This makes it an ideal material selection for 3D printing of other medical applications where it’s dangerous to have bacterial contamination, such as postoperative prostheses, wound dressing and surgical equipment. PLACTIVE also has thermoforming characteristics to help facilitate post-processing and final adjustments of the 3D printed application.